Intel SPTD Metallization and Etch Intern 2019 in Phoenix, Arizona

Job Description

Responsibilities may be quite diverse of a technical nature. U.S. experience and education requirements will vary significantly depending on the unique needs of the job. Job assignments are usually for the summer or for short periods during breaks from school.

Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. They are responsible for the thermal/mechanical/electrical design, analysis, and development of electronic packages. They conduct tests and research on basic materials and properties, establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance. They also provide consultation concerning packaging problems and improvements in the packaging process and respond to customer/client requests or events as they occur. Finally they develop solutions to problems utilizing formal education and judgment

The ideal candidate should exhibit the following behavioral traits:

  • Strong engineering troubleshooting and analytical skills.

  • Good team participation skills.

  • Strong communication and teamwork skills.

  • Demonstrated verbal and written communication skills.

  • Comfortable presenting issues and solutions to multiple layers of management.

  • Able to work with minimal direction in a lab environment

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.

Minimum Qualifications:

  • Be pursuing an M.Sc. or Ph.D. degree in Chemical Engineering, Chemistry, Material Science or related field.

  • 6+ months of experience in electrochemistry or electroless plating.

Preferred Qualifications:

  • Experience in studying surface interactions between metals and metals or metals and polymers

  • Familiar with surface analysis techniques

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....